① SK Hynix plans to issue ADRs in the US to raise $29 billion.
② Samsung may announce a share buyback worth 90 trillion Korean won for bonus payouts.
③ Apple is reported to begin mass production of its first foldable iPhone in late July.
Investors should note that Nvidia will hold its annual shareholder meeting at 1:00 a.m. Beijing time on Thursday. Company News [SK Hynix Plans US ADR Offering to Raise $29 Billion] SK Hynix plans to raise 45.45 trillion won ($29.4 billion) through the issuance of depositary receipts on Nasdaq. According to a statement released by the company on Wednesday, the securities are expected to begin trading on July 10. SK Hynix has submitted an application for a US IPO under the ticker symbol “SKHY.” BofA Securities, Citigroup, Goldman Sachs, and JPMorgan Chase are underwriters for the initial public offering (IPO). In its prospectus, SK Hynix stated that in the HBM market, the company ranked first globally with a 56.4% market share in the first quarter of 2026; in the first quarter of 2026, revenue from its US sales subsidiary accounted for 64.7% of total company revenue, compared with 68.8% in 2025; while in the first quarter of 2026, revenue from its China sales subsidiary accounted for 24.3% of total company revenue, compared with 19.7% in 2025. [Samsung May Announce Buyback of Stocks Worth 90 Trillion Won for Bonuses] According to reports, Samsung Electronics is preparing to repurchase nearly 90 trillion won worth of stock to distribute bonuses to employees and may announce relevant details soon. Samsung needs to repurchase shares because it previously reached an agreement with its labor union to pay special performance bonuses in the form of company stock. [Apple Reportedly to Mass-Produce First Foldable iPhone in Late July] According to reports, supply chain sources revealed that Apple has finalized key specifications for the foldable iPhone, including the display, casing, and mechanical components, and has entered the mass production preparation stage. Apple will begin mass production of its first foldable iPhone in late July. Recent rumors suggested that the model might be delayed due to hinge issues, but it is understood that Apple will still release it in September as originally planned. [Goldman Sachs Q2 Equities Trading Revenue Said to Exceed $5 Billion, Setting Another Industry Record] According to reports, Goldman Sachs Group’s equities trading business is set to set another record in the second quarter, with revenue expected to exceed $5 billion. Goldman Sachs’ equities trading performance was boosted by a surge in activity in Asian markets, which drove growth in trading and financing activities. This situation is mainly attributed to strong demand from hedge funds, which are keen to bet on the explosive growth of AI and related infrastructure investments.
Investor enthusiasm for SpaceX’s record-breaking IPO serves as another major boost to the equity trading businesses of major Wall Street institutions, with Goldman Sachs winning the coveted lead underwriter position in the deal.
【Masayoshi Son: SoftBank’s Arm to Enter Chip Manufacturing, ‘More Than 10x Growth Potential’】 On June 24, SoftBank Group Chairman Masayoshi Son stated at the shareholders’ meeting that its British chip design company Arm will evolve from a chip designer into a chip provider and will personally participate in manufacturing. He predicted that ‘the future AI era will be centered on CPUs’ and emphasized that Arm has ‘more than 10x growth potential.’ He also mentioned SoftBank’s investment of approximately 300 billion yen in Intel, saying it was ‘initially criticized’ but currently ‘has reached trillions of yen in profit by market value.’ 【ASML and Netherlands Organisation for Applied Scientific Research TNO Collaborate to Advance Photonic Chip Mass Production】 On June 24, ASML and the Netherlands Organisation for Applied Scientific Research (TNO) announced a partnership to jointly develop and promote the industrialization of photonic chips. The collaboration will revolve around TNO’s photonic chip pilot production line currently under construction at the High Tech Campus Eindhoven in the Netherlands. ASML will provide manufacturing technology support in phases, including DUV and I-Line lithography equipment. Once operational, the facility will have the capacity for mass production of 6-inch wafer-scale indium phosphide (InP) photonic chips.
